|<H1> Tong Hsing Electronic Industries, Ltd. </H1>|
|<H1> Microelectronic / Image Sensor Assembly </H1>|
|<H1> DPC / DBC substrate </H1>|
|<H1> Welcome to Tong Hsing Electronic Industries, Ltd. </H1>|
|<H2> Custom specilized Assembly Package. </H2>|
|<H2> DBC Substrate </H2>|
|<H2> DPC(TM) & Thin Film Substrate </H2>|
|<H2> Contact Us </H2>|
|<H5> The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing. </H5>|
Wolrd Class Provider of Micro Module Assembly and Thick Film and Thin Film Substrate Foundry Services Provider - Tong Hsing
Tong Hsing Electronic Industries, Ltd. is a Direct Bonded Copper (DBC) | Direct Plated Copper (DPC) substrate manufacturer since 1975. Tong Hsing is a service provider of RF and Microwave Modules , SiP and MEMS packaging in Asia Pacific, and the latest design guidelines including SMD, COB, Backend, CSP, Thick Film metallized Substrate, DPC, Multi-layer DPC, Control Plan for Electro Plating Cu / Ni / Au. Tong Hsing's Direct Bonded Copper and Direct Plated Copper substrates are applied in industries such as wireless communications, MEMS, image sensors, optical electronics, LED, solar cell, automotive electronics, computer peripherals, medical and network equipment.
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